· EMI Sputtering Target
· Package Substrate(PCB)
· Wafer Sawing Surfactant
· Laser Grooving Solution
· D/A Pick-up tool
· Wire Bonding Wires
· Epoxy Molding Compound
· Mold Rubber& Wax
· B/G Wheels & Pkg Blade
· Dummy Wafers

· QFN Backside tape
· Wafer mount tape
· Pkg Dicing tape
· PI Films For EMI Shielding
· Films for Display & Mobile

· Die Attach Parts/Tooling
· Wire Bonder Parts/Tooling
· Overhaul Parts
· Carrier/Magazine

· Loader/Un-Loader SYSTEM
· Tape Lamination SYSTEM
· Wafer Expansion SYSTEM
· Auto-Snap Cure SYSTEM
· L/F Inspection SYSTEM
· Wafer Probe Station
· Auto-Reel-Changer(SMT)
· Device Array Sorter