ELEVEN ELECTRON
Semiconductor Manufacturing
Main Product_ Mold Release Film
Item SV-3804M
Structure
Thickness (㎛) Total 42
Tensile Strength(Mpa) MD 65
TD 65
Elongation(%) MD 50
TD 50
Surface profile(㎛) Ra 0.66
Rz 2.0
Heat Shrinkage(%) - 0.1
Surface Resistivity((Ω/□)   109
180° Peel strength(gf) RT 2
175℃ X 10min 10
Main Product_ Mold Release Film Process
ELEVEN ELECTRON
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